We like a good underdog story here at Mobot, and Huawei is one of several manufacturers reaching for the proverbial stars this year after hiding in the shadows for years.
Huawei unveiled the new "world’s thinnest smartphone" at CES, the Ascend P1 S, and the manufacturer is set to crank it up a notch further at Mobile World Congress.
We heard last month that Huawei was promising to debut its “smartest, fastest and most high-performing smartphone yet” in Barcelona, and executive VP Michael Chuang whispered to TWICE about it – or should I say them – at CES.
Y’see, we’re told to expect not one but several new devices from Huawei at Mobile World Congress, under the name Diamond. My money’s on a Huawei Diamond S, if smartphone naming convention has taught me anything.
Other than the Diamond name, we’ve nothing to go on at the moment, but the specs to beat (from the Huawei Ascend P1 S) are a 4.3in Super AMOLED qHD display, 8MP camera, 1GB of RAM and 1.5GHz dual-core ARM A9 processing juice.
We’ll be fingering Huawei’s smartphone pie at Mobile World Congress in just under five weeks.